ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,555, issued on Dec. 2, was assigned to LG Electronics Inc. (Seoul, South Korea). "Display device using semiconductor light-emitting element ... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,037, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor package substrate with a smooth groove straddling top... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,374, issued on Dec. 2, was assigned to Rutgers, the State University of New Jersey (New Brunswick, N.J.). "Porous epoxy nanocomposite monoli... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,433, issued on Dec. 2, was assigned to PixArt Imaging Inc. (Hsin-Chu, Taiwan). "Signal transmission device, method, and time-of-flight dista... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,928, issued on Dec. 2, was assigned to Amazon Technologies Inc. (Seattle). "Systems and methods for low latency and lossless content streami... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,977, issued on Dec. 2, was assigned to ZYBIO INC. (Chongqing, China). "Vacuum chamber and cabin door structure" was invented by Nengke Pan (... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,756, issued on Dec. 2, was assigned to Baker Hughes Oilfield Operations LLC (Houston). "Methods for providing one or more positioning indica... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,906, issued on Dec. 2, was assigned to Precision Engine Controls Corp. (San Diego). "Ball valve with enhanced flow accuracy features" was in... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. D1,103,829, issued on Dec. 2, was assigned to Eliantte Group Inc. (New York). "Jewelry article such as a ring" was invented by Elliot Buryev (New Y... Read More
ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,979, issued on Dec. 2, was assigned to GLOBALWAFERS JAPAN Co. LTD. (Niigata, Japan). "Lamination wafers and method of producing bonded wafer... Read More